This is a proprietary Micro Film Contact solution that applies differentiated TPV (Through Polyimide Via) MEMS technology to separate contact bumps and signal patterns into two sides and enables compatibility with fine pitch (11um) with a structure connected through via.
By virtue of its innovative structure, the solution suffers no pattern damage due to particles in the process of repeated contact with the panels, and achieves excellent product reliability (Align precision and durability) by forming solid bumps.
